Measurement of the thermal conductivity of copper samples between 30 and 150 mK
Year: 2004
Authors: Risegari L., Barucci M., Olivieri E., Pasca E., Ventura G.
Autors Affiliation: Department of Mechanics, University of Florence, Florence, Italy; INFM, Unity of Florence, Florence, Italy; Department of Physics, University of Florence, Florence, Italy
Abstract: We report data of thermal conductivity between 30 and 150 mK of three different types of commercial copper, before and after a thermal treatment of the samples. The measurements show that both purity and thermal treatment strongly influence the value of thermal conductivity. Data show a strict linear dependence on the temperature of the thermal conductivity.
Journal/Review: CRYOGENICS (GUILDF.)
Volume: 44 (12) Pages from: 875 to: 878
KeyWords: Bending stresses; Commercial coppers; Electron-phonon scattering; Standard scaling, Annealing; Cooling; Data reduction; Electron scattering; Gravity waves; Heat treatment; Low temperature effects; Thermal conductivity; Thermometers, CopperDOI: 10.1016/j.cryogenics.2004.01.008ImpactFactor: 1.000Citations: 9data from “WEB OF SCIENCE” (of Thomson Reuters) are update at: 2024-11-10References taken from IsiWeb of Knowledge: (subscribers only)